SL LINK DDR4 8Gb SDRAM Component Selection Guide
As an authorized partner, we offer high-quality memory component solutions for the advanced UAV, industrial control, and electronics markets. This page provides a comprehensive product selection guide for SL LINK DDR4 8Gb SDRAM chips, featuring the mature, highly stable C-Die and the high-efficiency H-Die options to fulfill your diverse hardware design requirements.
- Pignal & Data Integrity
Supports Write CRC error detection and Command/Address (CA) Parity checking to ensure error-free operation and reliable data transmission at high speeds. - Ultra-Low Power Design
Operates at only 1.2V core and I/O voltage, featuring Maximum Power Saving mode and LPASR (Low-Power Auto Self-Refresh) with temperature-compensated refresh control to significantly reduce power consumption and heat generation. - Global Green Compliance
Fully compliant with Lead-Free RoHS standards and Halogen-Free requirements, while completely eliminating the use of the five PBT substances regulated under TSCA.
Technical Specifications & Selection Table
| Die Version | Configuration | Speed Grade (Mbps) | Timing | Package Type | Key Product Advantages |
|
C-Die |
|
2666 Mbps / 3200 Mbps | CL19-19-19 / CL22-22-22 |
|
Mature and highly stable supply chain with outstanding cost-performance efficiency, making it an ideal choice for mainstream and long-life applications. |
|
H-Die |
|
2666 Mbps / 3200 Mbps | CL19-19-19 / CL22-22-22 |
|
More optimized package dimensions, with enhanced data retention and refresh performance under high-temperature operating environments, delivering improved reliability and efficiency. |
Marking & Tracking Code
